METHOD AND EQUIPMENT FOR ELECTROLESS PLATING, AND METHOD AND EQUIPMENT FOR SUBSTRATE TREATMENT

摘要

PROBLEM TO BE SOLVED: To provide an electroless plating method and equipment which are capable of preventing the production of internal pores and are capable of forming a plating film improved in intra-surface uniformity and selectivity. SOLUTION: The method for electroless plating has a process step of bringing a substrate W into contact with the inside of an electroless plating solution 50 and forming the plating film on the surface of the substrate W and a process step of rubbing the surface of the plating film formed on the surface of the substrate W with a scrubbing member 56.