| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide copper alloy for a laminated board which has satisfactory wettability with varnish, an can directly be joined with polyimide without applying roughening treatment in a two-layered printed circuit board using a resin board manufactured by using a varnish containing polyamic acid. SOLUTION: In a copper alloy containing specified elements, by controlling the thickness of a rust prevention film to <=5 nm from the surface, the copper alloy foil for a lamination which has satisfactory wettability with varnish, and has excellent strength and electrical conductivity, and in which 180 deg. peel strength with a film obtained by thermally hardening polyamic acid is >=8.0 N/cm without undergoing roughening treatment is provided.</p> |
