| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier tape capable of suppressing deformation of a wall of an embossed hole and preventing deformation and damage of an electrode of a semiconductor package. SOLUTION: A carrier tape is provided with a tape material 2 and a plurality of embossed holes 4 concavedly formed side by side in a lengthwise direction of the tape material 2 to house a semiconductor package 20. Each embossed hole 4 is sectionally formed in a planar and approximately rectangular shape, stress-escaping portions 10 are outwardly formed at the four edges and the stress-escaping amount of the stress-escaping portion 10 is from 0.2 to not more than 1 mm. Since the stress-escaping portions 10 having low tenacity are connectively mounted at four edges of each embossed holes, the stress working on the carrier tape does not work on the whole circumferential wall area of the embossed hole 4 of the carrier tape but concentrates in the stress-escaping portions 10 and is absorbed in these portions.
|
