| 摘要 |
PURPOSE: A transferring apparatus of a semiconductor package is provided to reduce a fabricating cost by using a plurality of handlers changed according to various sizes of semiconductor packages without an additional transferring device. CONSTITUTION: A loader portion(102) has a plurality of ball insertion holes(104). The ball insertion holes(104) has a predetermined structure for receiving a ball grid array type semiconductor package. The ball insertion holes(104) are arranged according to the same interval. The first and the second handler(110,120) are located on an upper face of the loader portion(102). The first handler(110) is shifted to a left or a right direction according to a size of a horizontal axis of the received semiconductor package. The second handler(120) is shifted to an upper or a lower direction according to a size of a vertical axis of the received semiconductor package. The first and the second handler(110,120) are fixed by a support portion(130).
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