发明名称 |
BRUSH CLEANING APPARATUS OF CHEMICAL MECHANICAL POLISHING EQUIPMENT |
摘要 |
PURPOSE: A brush cleaning apparatus of a chemical mechanical polishing equipment is provided to prevent leakage of solution by using a fixing jig for connecting a solution line with a supply tube. CONSTITUTION: A brush core(110) is installed at one side of a core fixing portion(100). The brush core(110) is rotated by a rotary device. The brush core(110) has a plurality of holes(180) for injecting solution. The brush core(110) is surrounded by a brush(120). The brush(120) is wetted by the solution injected from the holes(180) of the brush core(110). A surface of the wafer is cleaned by the wet brush(120). The solution is supplied to the core fixing portion(100) through a solution line(140). The solution is supplied to the brush core(110) through the solution line(140) and a supply tube(150). The solution line(140) and the supply tube(150) are connected to each other by a connection portion(130). The connection portion(130) is fixed to an inner part of the core fixing portion(100) by using a screw(160). A fixing jig(170) is fixed to the inner part of the core fixing portion(100).
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申请公布号 |
KR20030008468(A) |
申请公布日期 |
2003.01.29 |
申请号 |
KR20010043123 |
申请日期 |
2001.07.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, HYEONG RYEOL;YANG, MIN SU |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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