| 摘要 |
PROBLEM TO BE SOLVED: To provide a vibration type sensor part requiring no vibration-proof measure, and to provide a sensor module. SOLUTION: A chip-like element 5 having a vibrator built therein is housed in a package 36 to form the vibration type sensor part 35. The side surface of the chip-like element 5 is held and fixed to the package 36 by an elastic member 40 and the bottom surface of the chip-like element 5 is arranged at a position floated so as to provide an interval with respect to the bottom wall of the package 36. An inner and outer continuity connection means for connecting the inside and outside of the package 36 in a continuity state is provided to the package 36. The electrode pad 38 of the inner and outer continuity connection means and the electrode pad 24 of the chip-like element 5 are connected in a continuity state by a wire 41. Since a vibration-proof measure is applied to the chip-like element 5 in the package 36, the vibration type sensor part 35 can be directly mounted on the surface of the sensor circuit board of the sensor module. Further, it is unnecessary to apply the vibration-proof measure to the sensor circuit board. |
