发明名称 AGENT FOR REMOVING FUNGUS
摘要 PROBLEM TO BE SOLVED: To provide a safe agent for removing fungi at the joint, hardly generating a harmful gas, and capable of preventing the fungi from reattaching after the removal of the fungi. SOLUTION: The spores of the fungi are decomposed by coating or spraying a colloidal titanium oxide on a position having the emerged fungi, and the reattachment of the fungi is prevented by degrading the soap residue which cause the emergency of the fungi. The titanium oxide is preferably a colloid- shaped suspended liquid of particles having 5-100 nm particle diameters, especially 5-50 nm particle diameters.
申请公布号 JP2003026526(A) 申请公布日期 2003.01.29
申请号 JP20010242956 申请日期 2001.07.06
申请人 DAIWA KAGAKU KOGYO KK 发明人 TSURUOKA MASAFUMI;MINEMURA KIMIE;MURAMATSU TAKAHIRO
分类号 A01N59/16;(IPC1-7):A01N59/16 主分类号 A01N59/16
代理机构 代理人
主权项
地址