| 摘要 |
PURPOSE: An optical sensor and a method for packaging the same are provided to control correctly a position of a packaging state by adhering a chip on a lead frame, performing a wire bonding process, and adhering an upper packaging body and a lower packaging body to each other. CONSTITUTION: A plurality of leads(110) are projected from both end portions from a plurality of packaging bodies(300,400). A light receiving hole(430) is formed on one side of the packaging bodies(300,400). The first and the second combination projection(310,320) are formed on the first packaging body(300). The first and the second combination groove(410,420) are formed on the second packaging body(400). A light receiving hole(430) is formed on the second packaging body(400). A lead frame(100) and a chip are installed between the first and the second packaging body(300,400). A plurality of leads(110) and a die(120) are formed on the lead frame(100). The first and the second position guide hole(130) are formed at both sides of the die(120).
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