发明名称 |
ELECTRO-DEPOSITED GRINDING WHEEL |
摘要 |
PROBLEM TO BE SOLVED: To improve cutting performance in grinding and discharge performance of chips. SOLUTION: A metal binder phase is formed on one face constituting almost a circle of a disk-state pedestal, and a large number of abrasive grains are stuck by this metal binder phase to form an abrasive grain layer 23. This abrasive grain layer 23 is constituted so that plural recess parts 26 are formed on its surface with an interval between each other. The abrasive grain layer 23 has an almost circular recess part 26 with the diameter of about 3 mm in plane view, and these recess parts 26 are arranged almost in the grid state or mesh state. |
申请公布号 |
JP2003025230(A) |
申请公布日期 |
2003.01.29 |
申请号 |
JP20010209582 |
申请日期 |
2001.07.10 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
YAMASHITA TETSUJI;NAKABAYASHI AKIRA;SHITAMAE NAOKI;HATA HANAKO |
分类号 |
B24B53/12;B24B53/017;B24D3/06;B24D7/00;H01L21/304 |
主分类号 |
B24B53/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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