| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid treatment apparatus and a liquid treatment method by which uniformity in liquid treatment to be applied to a substrate can be improved. SOLUTION: A plating treatment apparatus 1 is provided with a plating liquid tank 4 and a holder 11. An anode electrode 42 and a cathode electrode 22 are arranged at the insides of the plating liquid tank 4 and the holder 11, respectively. A potential difference is given to a space between the anode electrode 42 and a wafer W contacted with the cathode electrode 22 by an anode- cathode power source 25. A plurality of grid electrodes 46 are arranged on a space between the anode electrode 42 and the cathode electrode 22, and a potential difference is selectively given to a space between the grid electrodes 46 and the wafer W by a grid cathode power source 49.
|
