| 摘要 |
PROBLEM TO BE SOLVED: To obtain a highly adhesive and easily peelable composition which exhibits excellent heat dissipating effects and is re-processable after cure like a heat-dissipating molded sheet by leaving no space between a heat-generating component or a heat-dissipating component and a heat-dissipating material, and to provide an easily peeling device. SOLUTION: The highly adhesive and easily peelable composition comprises as essential ingredients the following components (A), (B), (C) and (D), where the component (B) is incorporated into a first liquid, and the component (C) is incorporated into a second liquid, and the components (A) and (D) are incorporated into either or both of the first and second liquids: (A) a liquid resin having a main chain skeleton composed of a polyisobutylene and bearing at least one alkenyl group in the molecule, (B) a hydrocarbyl compound bearing at least one hydrosilyl group in the molecule, (C) a hydrosilylation catalyst, and (D) a thermoconductive filler.
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