| 摘要 |
PROBLEM TO BE SOLVED: To provide a UV-curable resin composition having remarkably restrained adhesion, excellent in gold plating resistance of a cured body, suitable for use particularly in the formation of a soldering resist for a printed wiring board, etc., and developable with a dilute aqueous alkali solution. SOLUTION: The UV-curable resin composition comprises A. a UV-curable resin having a carboxyl group and two or more ethylenically unsaturated groups in one molecule, B. an epoxy compound having two or more epoxy groups in one molecule, C. a compound having a structure obtained by bringing a compound having a carboxyl group and an ethylenically unsaturated group in one molecule into ester linkage to a polypentaerythritol of formula (1) (where (n) is an integer of 3-6), D. a photopolymerization initiator and E. a diluent. |
