| 摘要 |
In a dielectric filter to be mounted on a printed circuit board, a conductive layer (x) formed on the surface of a dielectric substrate (1) includes an electroless copper-plated layer (m) formed on the surface of the substrate, and a conductive covering layer (n) having good dielectric conductivity and good solder wettability and formed on the surface of the electroless copper-plated layer (m). In place of the conductive covering layer (n) or in addition to the conductive covering layer (n), there is provided a protective synthetic resin layer (p) which covers the electroless copper-plated layer (m) or the conductive covering layer (n) and which vanishes upon exposure to heat of molten solder (25). Even when the conductive layer (x) is formed by electroless copper-plating, the conductive layer (x) is free from stain. Moreover, a terminal portion of the conductive layer (x) formed on the surface of the dielectric filter (1) can be soldered to a conductive path formed on a printed circuit board to thereby establish electric connection therebetween. <IMAGE> <IMAGE> |
