发明名称 |
BUILT-IN HEAT TRANSFER APPARATUS FOR USE IN PLANAR OPTICAL WAVEGUIDE DEVICE MODULE |
摘要 |
PURPOSE: A built-in heat transfer apparatus for use in planar optical waveguide device module is provided to be capable of making a thermal distribution of a planar optical waveguide device uniform by transferring the heat from a thermal source to the device, and of reducing a normal operating time of the device. CONSTITUTION: A radiation portion(24) is attached at a lower surface of a planar optical waveguide device(21), and an insulation layer(26) is coated on the lower surface(22) of the planar optical waveguide device(21). The radiation portion(24) is formed with a thin film on the lower surface(22) by a silk printing method. A pad(27) is attached to each of both ends of the radiation portion(24) so as to receive a power supply voltage through interconnection with a power line(28).
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申请公布号 |
KR20030008939(A) |
申请公布日期 |
2003.01.29 |
申请号 |
KR20010043977 |
申请日期 |
2001.07.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNG, SEON TAE;KWON, O DAL;LEE, SEUNG WAN;SHIN, SANG GIL |
分类号 |
G02B6/122;G02B6/02;G02B6/12;G02B6/34;(IPC1-7):G02B6/10 |
主分类号 |
G02B6/122 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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