发明名称 SILICON PRINTING METHOD USING SEMICONDUCTOR ETCHING PROCESS
摘要 PURPOSE: A method of engraving or embossing patterns of character and figure of various colors on a precious metal in various methods using semiconductor etching process. CONSTITUTION: The silicon printing method using semiconductor etching process comprises first process of coating a resist(2) on a silicon wafer(1); second process of resting a chromium mask(3) on the resist(2); third process of patterning the resist(2) using a light exposing equipment; fourth process of etching the silicon wafer(1) using etching process; fifth process of removing the resist(2); sixth process of forming a plating layer(4) by depositing or plating a precious metal such as gold or silver on the resist(2) removed etched silicon wafer(1); seventh process of coating the resist(2) again over the silicon wafer; eighth process of patterning the resist(2) using the light exposing equipment; ninth process of forming a dissimilar color plating layer(5) by depositing or plating the precious metal of gold or silver on patterned resist(2); and tenth process of removing the resist(2).
申请公布号 KR20030009249(A) 申请公布日期 2003.01.29
申请号 KR20020077328 申请日期 2002.12.06
申请人 PARK, YOUNG CHUL 发明人 PARK, YOUNG CHUL
分类号 B41M5/00;(IPC1-7):B41M5/00 主分类号 B41M5/00
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