| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition which excels in YAG laser imprinting properties and can reduce leakage failure. SOLUTION: The semiconductor sealing epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) carbon black as the essential components and is composed of a melt mixture obtained by melting part of the above epoxy resin and/or phenolic resin or the entire epoxy resin and/or phenolic resin and the above carbon black and the remaining components without having carbon black having a size of >=70μm in the cross section of a molded article of the above epoxy resin composition.
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