发明名称 PLATING EQUIPMENT WITH DISPLACEMENT PLATING PREVENTIVE MECHANISM
摘要 PROBLEM TO BE SOLVED: To provide a plating equipment with a displacement plating preventive mechanism which is capable of preventing the generation of a plating film. SOLUTION: This plating equipment with the displacement plating preventive mechanism holds a lead frame between water absorptive rollers arranged above and below the lead frame and dewaters a plating solution during intermittent conveyance and plates the lead frame by parting the water absorptive rollers penetrated with the plating solution during electroplating, thereby preventing the displacement plating between the plating solution and the lead frame.
申请公布号 JP2003027293(A) 申请公布日期 2003.01.29
申请号 JP20010213488 申请日期 2001.07.13
申请人 SUMITOMO METAL MINING CO LTD 发明人 KOBAYASHI TAKASHI;SHIOZAKI SHINJI
分类号 C25D21/00;(IPC1-7):C25D21/00 主分类号 C25D21/00
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