METHOD OF MANUFACTURING COF PACKAGE

摘要

A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive. <IMAGE>