WINDING CHANGE DEVICE FOR WIRE FOR CONNECTING SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a winding change guide device for a wire which prolongs the life of a winding change guide before a flaw defect occurs in the wire even if the wire delivered from a take-up machine is guided by the winding change guide and is taken up by the take-up machine and which is capable of improving linearity and decreasing product defects. SOLUTION: The winding change guide device for the wire for connecting semiconductor elements includes a guide rood which is formed by applying a hard film to a sintered hard alloy base material and is characterized in that the average grain size of the sintered hard alloy crystal of the sintered hard alloy base material is <=2.0 μm. More preferably the guide rod is attachably and detachably and freely rotatably fixed to a guide bracket.