发明名称 |
Making interconnections to a non-flat surface |
摘要 |
A non-planar surface may be surface mounted to another surface using solder balls that may be modified to generate a planar surface for receiving the second surface. In one embodiment, the solder balls may be secured to an irregular surface and then scrapped to form a planar contacting surface. A second surface to be bonded to the first surface may then be attached to the planar contacting surface and the solder balls reflowed to create a surface mount.
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申请公布号 |
US6512301(B1) |
申请公布日期 |
2003.01.28 |
申请号 |
US20010904238 |
申请日期 |
2001.07.12 |
申请人 |
INTEL CORPORATION |
发明人 |
PALANISAMY PONNUSAMY;DEMARCO JAMES R. |
分类号 |
H05K3/34;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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