发明名称 |
Packaging and assembly method for optical coupling |
摘要 |
A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has optical waveguide structures in addition to electrical connections. An optically active device may be flip-bonded directly to an integrated circuit using solder bump technology. The integrated circuit then flip-bonded or wire-bonded to a BGA package. The package has alignment rails or balls and V-grooves to anchor the alignment rails/balls to align the BGA package to the PCB. The BGA package is bonded to the PCB using solder reflow technology.
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申请公布号 |
US6512861(B2) |
申请公布日期 |
2003.01.28 |
申请号 |
US20010892921 |
申请日期 |
2001.06.26 |
申请人 |
INTEL CORPORATION |
发明人 |
CHAKRAVORTY KISHORE K.;YOUNG IAN A.;AHADIAN JOSEPH F.;SWAN JOHANNA MARIE |
分类号 |
G02B6/42;H05K1/02;H05K3/34;(IPC1-7):G02B6/12 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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