| 摘要 |
According to one embodiment, a number of trace metal segments or conductors are patterned onto a top surface of a substrate suitable for receiving and housing a semiconductor die. In one embodiment, an insulator layer covers the trace metal segments and separates them from a high permeability core which is mounted on top of the insulator layer. The insulator layer can comprise, for example, solder mask while the high permeability core can comprise, for example, a ferrite rod. In one embodiment, a number of bonding wires are passed over the high permeability core and make connections to respective trace metal segments under the core so as to create an inductor winding around the core. The terminals of the inductor so formed can be connected to a substrate bond pad and/or to a semiconductor die bond pad.
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