发明名称 SOLDERING METHOD AND SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain an excellent fillet shape by feeding a sufficient amount of soft solder to a part to be soldered and to secure excellent wettability to realize soldering of high productivity which does not cause defective bridging. SOLUTION: In a spout soldering method, a work 3 to be soldered is brought into contact with molten solder spouted from a spout guide 2 upwardly in the reverse-oblique direction to the advancing direction of the plate-like work 3. The solder is spouted to a horn-like squirt hole 4 from the spout guide 2 and diffused over the horn-like squirt hole 4 in a ridge shape to form a diffused spout part 5. A ridge-shaped wave spout part 6 is formed by the wave generated when the molten solder flows from the ridge-shaped diffused spout part 5 in a spreading manner. The plate-like work 3 is soldered by bringing into contact with the wave spout part 6.
申请公布号 JP2003025063(A) 申请公布日期 2003.01.28
申请号 JP20010207863 申请日期 2001.07.09
申请人 NIHON DENNETSU KEIKI CO LTD;MATSUSHITA ELECTRIC WORKS LTD 发明人 YAMAMOTO OSAMU;KAI AKINORI;KUROI SHUICHI;YUKI KEISUKE;MIYAI TAKAO
分类号 B23K3/06;B23K1/08;B23K101/42;H05K3/34;(IPC1-7):B23K1/08 主分类号 B23K3/06
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