发明名称 |
SOLDERING METHOD AND SOLDERING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To obtain an excellent fillet shape by feeding a sufficient amount of soft solder to a part to be soldered and to secure excellent wettability to realize soldering of high productivity which does not cause defective bridging. SOLUTION: In a spout soldering method, a work 3 to be soldered is brought into contact with molten solder spouted from a spout guide 2 upwardly in the reverse-oblique direction to the advancing direction of the plate-like work 3. The solder is spouted to a horn-like squirt hole 4 from the spout guide 2 and diffused over the horn-like squirt hole 4 in a ridge shape to form a diffused spout part 5. A ridge-shaped wave spout part 6 is formed by the wave generated when the molten solder flows from the ridge-shaped diffused spout part 5 in a spreading manner. The plate-like work 3 is soldered by bringing into contact with the wave spout part 6. |
申请公布号 |
JP2003025063(A) |
申请公布日期 |
2003.01.28 |
申请号 |
JP20010207863 |
申请日期 |
2001.07.09 |
申请人 |
NIHON DENNETSU KEIKI CO LTD;MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
YAMAMOTO OSAMU;KAI AKINORI;KUROI SHUICHI;YUKI KEISUKE;MIYAI TAKAO |
分类号 |
B23K3/06;B23K1/08;B23K101/42;H05K3/34;(IPC1-7):B23K1/08 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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