发明名称 SCORING DEVICE FOR PACHINKO MACHINE
摘要 PROBLEM TO BE SOLVED: To provide a scoring device which facilitates processing such as the removal of circuit chips at and after the discovery of the circuit chips attached onto sensors, as compared with the structure having the sensors incorporated deeper inside the body of the device, in the structure having the sensors incorporated not so deeper inside the body of the device, but making the sensors hard to remove from the body of the device. SOLUTION: The scoring device for the pachinko machine which is provided with the body 4 thereof having a prize ball passage 1 formed therein and a sensor 5 for detecting the prize balls in the prize ball passage 1, a holder 6 is so arranged as to detachably insert the sensor 5 from one direction only and the holder 6 with the sensor inserted thereinto is detachably mounted from one direction only at a specified position of the body 4 to let it be fastened on the body 4 of the device from outside when mounted. Portions of the holder 6, with a sensor case 5a and the sensor inserted thereinto, facing a sensor circuit part 5d are made up from transparent materials separately to allow the visual recognition of the attaching of the circuit chips intended for fraudulence at points corresponding to the sensor circuit part.
申请公布号 JP2003024520(A) 申请公布日期 2003.01.28
申请号 JP20010211033 申请日期 2001.07.11
申请人 HEIWA CORP 发明人 KUSANO TAKEYASU
分类号 A63F7/02;(IPC1-7):A63F7/02 主分类号 A63F7/02
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