发明名称 |
Mechanically interlocking ball grid array packages and method of making |
摘要 |
A method and apparatus for providing a ball grid array assembly formed from interlocking ball grid array packages is disclosed. Each of the ball grid array packages has interlocking edge features for mechanical connection, whereby joining the plurality of ball grid array packages via the interlocking edge features forms the interlocking ball grid array assembly. The interlocking ball grid array assembly may then be mounted on a PC board as a single unit.
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申请公布号 |
US6512293(B1) |
申请公布日期 |
2003.01.28 |
申请号 |
US20010875055 |
申请日期 |
2001.06.05 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
CHIA CHOK J.;LIM SENG SOOI;LIEW WEE K. |
分类号 |
H01L23/498;H01L23/544;H01L25/10;H05K1/18;(IPC1-7):H01L23/04 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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