发明名称 MULTILAYERED SUBSTRATE AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a multilayered substrate that can simply its manufacturing process even when the substrate only has electrodes on one surface, and to provide a method of manufacturing the substrate. SOLUTION: After a conductor pattern 22 is formed on a resin film 23 composed of a thermoplastic resin, surface-treated layers 32 finished by nickel - gold plating are formed on the surface of the pattern 22 and a one-sided conductor pattern film 31 having via holes 24 filled with conductive paste 50 and one-side conductor pattern films 21 formed through a similar step as that of the film 31 except the formation of the surface-treated layers 32 are laminated upon another (Fig. (e)). Then this multilayered substrate 100 is obtained by heat-pressing the films 21 and 31 against each other from both surfaces of the laminate (Fig. (f)). Since the multilayered substrate 100 only having electrodes 33 on one surface can be manufactured by only using the films 21 and 31 in this way, the manufacturing process of the substrate 100 can be simplified.</p>
申请公布号 JP2003023250(A) 申请公布日期 2003.01.24
申请号 JP20010206889 申请日期 2001.07.06
申请人 DENSO CORP 发明人 KONDO KOJI
分类号 H05K1/11;H05K1/02;H05K1/05;H05K3/24;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/11
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