发明名称 SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment device with which accurate control is enabled without vibration and the adjustment of a control system is facilitated even in a heat treatment furnace mutually strongly interfering a plurality of detected temperatures provided respectively corresponding to a plurality of heaters. SOLUTION: Measured temperatures in a plurality of zones are respectively compared with temperature setting values c1-c3 of a plurality of heaters h1-h3 by adders d1-d3, the respective compared results are inputted to a plurality of control units f1-f3, power control signals a1-a3 are operated and the ratio of interference in each of zones is multiplied to the respective operated power control signals a1-a3 by an interference ratio operating part 20 so that a final power control signal can be provided.
申请公布号 JP2003022978(A) 申请公布日期 2003.01.24
申请号 JP20010209875 申请日期 2001.07.10
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 YAMAGUCHI HIDETO;UENO MASAAKI
分类号 F27D19/00;G05B11/32;G05D23/00;H01L21/205;(IPC1-7):H01L21/205 主分类号 F27D19/00
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