| 摘要 |
<p>PROBLEM TO BE SOLVED: To allow a temperature of a wafer mounted on the mounting surface of a wafer-mounting stage to be accurately measured with proper response. SOLUTION: An apparatus for manufacturing a semiconductor using the wafer-mounting stage 1 comprises a plate-like ceramic body for forming the wafer-mounting stage 1 having a recess 6 formed on a surface of the body at an opposite side to the mounting surface 3, a sheath type temperature measuring instrument 10 pressed into contact with an inner wall surface of the recess in such a manner that the maximum width of the recess 6 is set to 0.25 mm to 5 mm, the surface roughness of a contact part P with the instrument 10 is set at a maximum height (Rmax) of 5μm or less, and the distance (T) from the contact part P to the surface 3 with the instrument 10 is set to 0.3 mm to 10.0 mm.</p> |
