| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip with bump for measuring a bonding damage, which can quantitatively measure data on the cause of the damage occurred in a bonding part. SOLUTION: In the chip with bump for measuring the bonding damage, the damage occurred in the chip 10 by bonding is measured by a distortion gauge. A bump 12g is formed in a first electrode 11g where the distortion gauge 13 is formed. The signal lines 14 of the distortion gauge 13 are connected to electrodes 11c, 11d, 11e and 11f where bumps 12c, 12d, 12e and 12f are formed. In distortion measurement when the chip 10 is bonded to the substrate, a signal showing the electrical change of the distortion gauge 13 is extracted through the bonding pad of a substrate to which the bumps 12c, 12d, 12e and 12f are bonded. Thus, data on the cause of the damage occurred in bonding can quantitatively be measured.
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