发明名称 PRINTED BOARD DEVICE
摘要 PROBLEM TO BE SOLVED: To ensure reliability of connection between a lead and a wiring pattern by preventing stripping of solder and a land. SOLUTION: A solder coat f is provided to cover the inner circumferential surface at the tubular part a1 of a land a and the upper and lower surfaces at the flange part a2 and solder e for connecting a lead wire L is provided on the inner circumferential surface at the tubular part f1 of the solder coat f and on the upper and lower surfaces at the flange part a2. Since the outside diameter at a projecting part e1 is set smaller than the outside diameter at the flange part f2 on the upper and lower surface sides of the solder coat f, the projecting part e1 of the solder e does not function to raise the flange part f2 thus preventing easy stripping.
申请公布号 JP2003023237(A) 申请公布日期 2003.01.24
申请号 JP20010206294 申请日期 2001.07.06
申请人 AMTEX CORP 发明人 MIZUGUCHI NORIO
分类号 H05K3/34;H05K3/24;(IPC1-7):H05K3/24 主分类号 H05K3/34
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