| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively perform conditioning without damaging the surface of a semiconductor wafer. SOLUTION: This device has a polishing mechanism for pressing and chemically and mechanically polishing a semiconductor wafer 5 on a polishing pad 1 to which a polishing slurry is fed, and a heat radiating device 8 for conditioning the surface of the polishing pad 1 with a plurality of heat sources. Thus, the holding rate of the polishing slurry can be improved and the resistance of contact with the semiconductor wafer 5 can be improved. Further, since diamond grind grains are not used, the surface of the semiconductor wafer 5 is not damaged by the drop of diamond and inexpensive conditioning can be stably performed. Besides, this device is provided with a cleaning brush 9 for cleaning ground chips generated by heat radiation, by friction while using laser light for the heat source of the heat radiating device 8 and a nozzle 10 for washing the surface of the polishing pad. |
