| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode section structure for printed board that can realize higher reliability by improving the junction reliability between a CSP and a solder ball and, at the same time, preventing the disconnection of wiring arranged on the printed board caused by a thermal stress applied to the wiring. SOLUTION: When a CSP land structure is constituted so that a solder resist may not cover a copper pattern, the junction reliability between the CSP and solder ball is high, but the wiring led out from a land is exposed and the solder ball is joined to the exposed portion of the wiring. Therefore, the occurrence of disconnection of the wiring is eliminated by stabilizing the shape of the solder ball and, at the same time, preventing the thermal stress applied to the wiring at the time of joining the CSP to the solder ball by covering the exposed portion of the wiring with the solder resist. |
