发明名称 |
CURABLE COMPOSITION FOR ETCHING RESIST |
摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition for an etching resist giving a cured film excellent in etching resistance even in secondary etching at a high temperature and excellent also in suitability to subsequent alkali dissolution and removal and in pattern forming property and suitable for use as a backing material particularly in the manufacture of a shadow mask. SOLUTION: The curable composition contains (a) a compound having one carboxyl group and one (meth)acryloyl group in one molecule and (b) a compound having one or more carboxyl groups and two or more (meth)acryloyl groups in one molecule. |
申请公布号 |
JP2003021899(A) |
申请公布日期 |
2003.01.24 |
申请号 |
JP20010206543 |
申请日期 |
2001.07.06 |
申请人 |
TOAGOSEI CO LTD |
发明人 |
ITO AKIKO;NAGOSHI HIROYUKI;NIWA MAKOTO;IGARASHI ICHIRO |
分类号 |
G03F7/027;C08F2/50;C08F220/18;C08F220/26;G03F7/028 |
主分类号 |
G03F7/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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