发明名称 CURABLE COMPOSITION FOR ETCHING RESIST
摘要 PROBLEM TO BE SOLVED: To provide a curable composition for an etching resist giving a cured film excellent in etching resistance even in secondary etching at a high temperature and excellent also in suitability to subsequent alkali dissolution and removal and in pattern forming property and suitable for use as a backing material particularly in the manufacture of a shadow mask. SOLUTION: The curable composition contains (a) a compound having one carboxyl group and one (meth)acryloyl group in one molecule and (b) a compound having one or more carboxyl groups and two or more (meth)acryloyl groups in one molecule.
申请公布号 JP2003021899(A) 申请公布日期 2003.01.24
申请号 JP20010206543 申请日期 2001.07.06
申请人 TOAGOSEI CO LTD 发明人 ITO AKIKO;NAGOSHI HIROYUKI;NIWA MAKOTO;IGARASHI ICHIRO
分类号 G03F7/027;C08F2/50;C08F220/18;C08F220/26;G03F7/028 主分类号 G03F7/027
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