| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board for multilayered circuit board in which occurrence of incomplete contact or positional shift of a conductor circuit is suppressed at the time of laying printed circuit boards in multilayer. SOLUTION: In a circuitboard where a conductor circuit is formed on at least one side of an insulating basic material, the core material of the insulating basic material is formed of organic polymer, e.g. an aramid film, and impregnated with epoxy resin and the linear thermal expansion coefficient of the insulating basic material is set in the range of +10 ppm/ deg.C to -10 ppm/ deg.C. |
