| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board in which cracks hardly occur in resin-made interlayer insulating layers and which is excellent in reliability. SOLUTION: This multilayered printed wiring board is constituted by successively alternately laminating conductor circuits and the resin-made interlayer insulating layers upon a substrate and connecting conductor circuits on and under the insulating layers to each other through via holes-In addition, a solder resist layer is formed as the outermost layer. Of the via holes, those in different hierarchies are laminated upon another. Of the laminated via holes, in addition, at least one is laminated by shifting its center from those of the other via holes. The other via holes are laminated upon another so that their centers may roughly lie upon the centers of the other via holes. |
