发明名称 METHOD FOR MANUFACTURING LOW TEMPERATURE BAKED CERAMIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To prevent cracks from being generated in a constraint green sheet or a baked substrate used at the time of constraint baking of a low temperature baked ceramic substrate. SOLUTION: A method for manufacturing the low temperature baked ceramic substrate comprises the steps of laminating and press bonding the constraint green sheets 12 on both side surfaces of the low temperature baked ceramic raw substrate 11, interposing the substrate 11 between porous setter plates 13, and baking the substrate at 800 to 1,000 deg.. The method further comprises a step of forming the sheets 12 so that a baking shrinkage factor in a surface direction becomes 3% or less by regulating a binding amount of an organic matter such as a binder or the like, a type of the binder, and a particle size of the ceramic powder. If the shrinkage factor of the sheet 12 is 3% or less, a stress operating at the sheet 12 during constraint baking becomes a compression stress or even when a tensile stress is operated, only a small tensile stress is operated. Thus, the crack generated due to an excess tensile stress operated at the sheet 12 during the constraint baking can be prevented.
申请公布号 JP2003023122(A) 申请公布日期 2003.01.24
申请号 JP20010206623 申请日期 2001.07.06
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 FUKUDA JUNZO;ADACHI SATOSHI
分类号 C04B35/622;H01L23/12;H05K3/46 主分类号 C04B35/622
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