发明名称 COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling device of as small a size as possible, which efficiently and uniformly sinks heat emitted from a heat source. SOLUTION: The cooling device 1 is provided with a cooling unit 10 which is provided with; a hollow panel 11 accommodating therein a cooling medium and having an evaporating portion 11V, at the side of an endothermic surface 11a, for absorbing heat with the evaporation of the cooling medium, and a condensing portion 11C, at the side of an exhaust heat surface 11b, for emitting heat with the condensation of the cooling medium, while the endothermic surface 11a being confronted with a heat diffusing furnace H and being allowed to extend in the vertical direction; and a cooling jacket 12 which is disposed so as to face the surface 11b of the panel 11 and define a cooling channel 13 that confronts the surface 11b.
申请公布号 JP2003021480(A) 申请公布日期 2003.01.24
申请号 JP20010208190 申请日期 2001.07.09
申请人 KOMATSU LTD 发明人 MATSUKI TERUYUKI;KADOTANI KANICHI
分类号 F28D15/02;H01L21/22;H01L23/427;H01L23/473;(IPC1-7):F28D15/02 主分类号 F28D15/02
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