| 摘要 |
PROBLEM TO BE SOLVED: To provide an image pick-up device that has a structure allowing the manufacturing work of the device to be simplified and has excellent image pick-up properties. SOLUTION: The image pick-up device 10 is provided with (1) a solid-state imaging element 20 having photoelectric transducing parts 22 arrayed in a two-dimensional shape on the principal surface of a semiconductor substrate, (2) a fiber optical plate 30 formed by bundling a plurality of optical fibers 31 each having a core 34 and a clad 35 to cover the periphery of the core 34 and having an incident plane 32 and a light-emitting plane 33 which are inclined to the optical axis of an optical fiber 31, and (3) an optical diffusing member 40 provided between a solid-state imaging element 20 and the light- emitting plane 33 of the fiber optical plate 30.
|
