METHOD FOR SORTING DEFECT OF SEMICONDUCTOR DEVICE, METHOD FOR PREDICTING YIELD OF THE SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE, DEFECT-SORTING SYSTEM OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE-SORTING APPARATUS, AND PROGRAM USED THEREFOR AND RECORDING MEDIUM

摘要

PROBLEM TO BE SOLVED: To execute an accurate defect fatalness evaluation, a yield prediction and a fault position specification in an in-line defect checking step. SOLUTION: A method for sorting defects of a semiconductor device comprises steps of extracting a wiring position which becomes a fault candidate by superposing layout pattern data of a semiconductor chip with a defecting image, discriminating wirings of the extracted fault candidate according to a wiring function type, and sorting a short-circuit mode type, a disconnection mode type or the like according to a wiring fault mode type.