METHOD FOR MULTIPLE-CUTTING OF SUBSTRATE AND APPARATUS FOR MULTIPLE-CUTTING OF SUBSTRATE FOR EXECUTING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method for multiple-cutting of a substrate, in which light is split to cut the substrate into a plurality of pieces with a single light beam, and an apparatus for multiple-cutting of the substrate for executing the method. SOLUTION: The substrate is multiple-cut into pieces by mounting at least >=2 light reflectivity/transmittance control plates (310-340, 610-640) on a path through which the light having a required power passes such that the light reflectivity/transmittance is varied depending on an angle between the light and the plates to heat a plurality of surface portions of the substrate simultaneously and jetting a cooling medium to the heated substrate. Resultantly, a cutting time is substantially shortened and the productivity is enhanced.