METHOD AND DEVICE FOR PROCESSING FINE CAVITY IN TRANSPARENT DIELECTRIC MATERIAL BY USE OF LIGHT

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for processing a fine cavity by the use of light, by which a long hole having a diameter of from several tens of micron to submicron can be formed in a transparent dielectric material. SOLUTION: In the device for processing the fine cavity in the transparent dielectric material by the use of light, the transparent dielectric material 5, a liquid 6 being brought into contact with an end face of the transparent dielectric material 5, an ultrashort light pulse irradiation means 1 capable of irradiating from an interface between the end face of the transparent dielectric material 5 and the liquid 6 to the other end face of the transparent dielectric material 5 while scooching, and an imaging means 9 for imaging the processed conditions of the fine cavity formed by the ultrashort light pulse irradiation are provided.