发明名称 THIN FILM COIL MODULE, ITS MANUFACTURING METHOD AND ITS USING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a thin film coil module, its manufacturing method and its using method which is superior in heat radiation characteristic and hence allows a high current to flow. SOLUTION: The thin film coil module comprises a thin film coil array 1 of thin film coil elements C arranged in a two-dimensional matrix and buried in a coil insulation member, a diode array 3 of diodes D arranged in a matrix synchronous with the matrix layout of the coil elements, and a heat sink 2 made of a high heat conductive material. The heat sink is sandwiched between the arrays 1, 3. The coil insulation member is a diamond thin film 1i.
申请公布号 JP2003022911(A) 申请公布日期 2003.01.24
申请号 JP20010209251 申请日期 2001.07.10
申请人 FUJI ELECTRIC CORP RES & DEV LTD 发明人 WATANABE YASUMASA
分类号 H01F17/00;H01L25/00;(IPC1-7):H01F17/00 主分类号 H01F17/00
代理机构 代理人
主权项
地址