| 摘要 |
PROBLEM TO BE SOLVED: To provide an aluminum nitride sintered compact which has remarkably increased deflective strength and improved thermal impact resistance while maintaining its densiness and high thermal conductivity equal to or above those of the conventional one, to provide its production method, and to provide a circuit board using the aluminum nitride sintered compact as an aluminum nitride board. SOLUTION: In the aluminum nitride sintered compact, a samarium(Sm) yttrium(Y) aluminum(Al) based multiple oxide is present in an intergranular phase, and the density of the compact is >=3.1 g/cm<3> , and the three point bending strength of the compact is >=400 MPa. The method for producing an aluminum nitride sintered compact can be applied to the production of the aluminum nitride sintered compact. The circuit board uses the aluminum nitride sintered compact as an aluminum nitride board. |
