| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor device which can easily supply a molten metal to grooves for forming heat sink fins without quenching and which has a structure for hardly generating a bi-metal effect. SOLUTION: A method for manufacturing a heat sink for mounting an element comprises steps of filling a filling metal 6A in a through hole 5A formed so as to penetrate from one surface to the other surface of a plate-like preform 5, disposing a power semiconductor element 4 on one surface side of the preform 5, and integrally standing heat sink fins 6D with the same metal material as the filling metal 6A at the other surface of the preform 4.
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