METHOD AND DEVICE FOR TREATING WAFER

摘要

PROBLEM TO BE SOLVED: To prevent a large quantity of foams from being discharged to the outside of a treatment tub when a treatment liquid with which a large quantity of foams are generated is used with spraying to a wafer. SOLUTION: The treatment liquid is sprayed from a shower unit 13 to the surface of a wafer 30 conveyed inside a treatment tub 10. The forms which are generated with the spray of the treatment unit are stagnated in the treatment tub 10, and only the liquid component of the sprayed liquid is discharged to a tank 20 outside the tub. By spraying the treatment liquid after the wafer 30 is discharged from the treatment tub 10, the foams left in the treatment tub 10 are mechanically destroyed. The inflow of the foams to the tank 20 is avoided and the malfunction or the like of a liquid level sensor in the tank 20 is prevented.