| 摘要 |
PROBLEM TO BE SOLVED: To provide superior wiring with a high adhesion property on a base without the need for a vacuum device or the like and without the need for the means of corroding an insulation layer, and to form recessed and projected parts and improve the adhesion property, etc., regarding a wiring formation method. SOLUTION: The wiring formation method is provided with a process of applying a photosensitive thermosetting resin composition containing at least a metal complex on a support base body and forming a thermosetting resin layer 23 with photosensitivity, a process of forming a required pattern by conducting pattern exposure and development to the photosensitive thermosetting resin layer, then heating and setting it, depositing metal on the surface and making a metal layer 25 generated and a process of performing plating thickening by an electroless plating method with the metal layer as a seed layer and forming a wiring layer 27.
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