| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip sealing medium which has a high glass transition temperature of a cured product and low moisture-absorption, excels in a balance in mechanical strength such as stress relaxation, and has good weatherability and tracking resistance, and furthermore a liquid sealing medium having good storage stability even in the presence of a curing agent. SOLUTION: The semiconductor chip sealing medium has, as the resin component, a polymer having a structure in which repeating units derived from a cyclic conjugated diene monomer as such have been directly epoxidized.
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