发明名称 METHOD FOR MANUFACTURING SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate in which the substrate can be protected against scratch or damage due to housing or carriage when a conductive material on the substrate is removed using an energy beam. SOLUTION: In a touch panel substrate, a surface protection laminate film 10 is pasted uniformly to the upper surface of a transparent conductive film 4 and the lower surface of an insulating transparent substrate 3. The laminate film 10 is composed of a material transmitting laser light well and not being machined easier than the transparent conductive film 4 with laser light, e.g. PET, PC, PN, or the like. When the transparent conductive film 4 on the insulating transparent substrate 3 is irradiated with pulse laser light through the laminate film 10, the pulse laser light transmits the laminate film 10 to reach the transparent conductive film 4, and removes the transparent conductive film 4 in a specified pattern. Since the laminate film 10 is not machined easier than the transparent conductive film 4, it adheres onto the transparent conductive film 4 even after machining while keeping the substantially same state as that before machining thus protecting the substrate against damage due to carriage or housing.</p>
申请公布号 JP2003023230(A) 申请公布日期 2003.01.24
申请号 JP20010204352 申请日期 2001.07.05
申请人 RICOH MICROELECTRONICS CO LTD 发明人 MIYAMOTO KAZUNORI
分类号 B23K26/12;B23K101/42;H05K3/08;(IPC1-7):H05K3/08 主分类号 B23K26/12
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