| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition which can fix a fine-gauge gold wire easily and at a low cost, and a light emitting device package. SOLUTION: The thermosetting epoxy resin composition is employed to fix a gold lead wire of a fine-gauge inserted into a through-hole formed in a cap-like eyelet in the light emitting device package, and has a glass transition temperature of a cured product of higher than 200 deg.C.
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