| 摘要 |
The invention relates to a method for the production of a microscopic component in a substrate (10), comprising the following steps: carrying out a first isotropic charge etching of the substrate (10), through a mask (11), comprising a collection of openings (12, 13, 14, 15) which are substantially arranged point-shaped in a matrix network, the area of each opening (12, 13, 14, 15) being determined by the depth to be etched beneath said opening (12, 13, 14, 15) and carrying out a second isotropic etching of the substrate (10) in the absence of the mask (11). |
